Unique spout
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For a unique finish, add this pair of stud earringsfeaturing unique fish bone shape, these earrings will make you stand out in any crowd
India
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Thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivemomentive offers boron nitride insulators and washers for vacuum furnacesits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsdelhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mob
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Equallogic ssd drives require a unique tray with sata interposerscom hi all we have dell storage for rent & sales dell equallogic san ps storage specification: processor: supported drives: all drives require unique equallogic firmwaremobile: 080- website: wwwps controller type 7 (green) 4 x 1 gb rj45 1 x management port rj45 1 x serial port db9 4 ip addresses needed per chassis for ports eth0 thru eth3 only one controller is active at a time1x x 19 inches weight: 80 pounds with 16 drives installed standardized chassis ps series - 2 x type 7 controllers ps series - 2 x type 10 controllers 2 x 450 watt power suppliesfor more details, contact us: mobile: 080 website: wwwthe other controller is purely a standby until failover occurscom e-mail: signwave technologies # 32,2nd main, 7th cross,muniyappa layout, garebhavi palya, bangalorecontrollers will fail over from primary to secondary, corresponding ip addresses switch automaticallysas 15k - gb sas 10k - 600 gb sata - tb rpm nl-sas - 3 tb rpm nl-sas sed - 3 tb rpm ssd - gb sata version 6 firmware and higher support raid levels editors note: raid 5 removed in order to increase reliability 3 tb nl-sas drives - raid 50 is not a raid option version 5 firmware supports raid levels firmware upgrade path thru version 8 series is assured 16 max members in one group dimensions: 5autoswitching volts ac, hertz each 16 drive chassis requires 3 amps at 120 volts (6 amps required for cold start up) backplane: " drives with equallogic trays supporting specified size sas or sata drives equallogic interposers required for sata drives
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Thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernlocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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Thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents