Tangent
List tangent
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Genuine leather tangent 3+1+1 luxurious sofa unit is long with premium sofa hugging covers,7o219o
₹ 32000
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It's a tangent product6 seater round dinning table seta bench for 2 persons and 4 chairs
₹ 20000
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Bought from tangent furniture shopdiscounted if bought all togetherdiscounted price altogether: rs original price altogether: rswilling to sell the revolving chairs separatelyindividual chairs: rs
₹ 10000
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This is a 3 seater sofa from tangent furniture it is 6 years old and in good condition and comes with an additional removable cover it has a vibrant color, perfect to brighten up your living room
₹ 12000
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Rd floor, kamdhenu industrial estate, mindspace, behind tangent showroom, malad west mumbai-, maharashtra, india kunal mehtatop manufacturers, exporters and suppliers of phthalo blue pigments for paints, textiles, rubber, plastics, ink industries, etcnet is the leading manufacturing company for phthalocyanine pigments in india
₹ 700000
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivemomentive offers boron nitride insulators and washers for vacuum furnacesthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsdelhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mob
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivethermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernlocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivethermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivethermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishmarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
