Tangent
List tangent
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Genuine leather tangent 3+1+1 luxurious sofa unit is long with premium sofa hugging covers,7o219o
₹ 32000
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It's a tangent product6 seater round dinning table seta bench for 2 persons and 4 chairs
₹ 20000
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Bought from tangent furniture shopdiscounted if bought all togetherindividual chairs: rswilling to sell the revolving chairs separatelydiscounted price altogether: rs original price altogether: rs
₹ 10000
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This is a 3 seater sofa from tangent furniture it is 6 years old and in good condition and comes with an additional removable cover it has a vibrant color, perfect to brighten up your living room
₹ 12000
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Rd floor, kamdhenu industrial estate, mindspace, behind tangent showroom, malad west mumbai-, maharashtra, india kunal mehtatop manufacturers, exporters and suppliers of phthalo blue pigments for paints, textiles, rubber, plastics, ink industries, etcnet is the leading manufacturing company for phthalocyanine pigments in india
₹ 700000
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmomentive offers boron nitride insulators and washers for vacuum furnacesdelhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivehot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machined
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbr uses calcium borate as a strengthening binder and is moisture insensitive
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processinglocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitive
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They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsmarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobhot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitive
