Semiconductor physics and devices
List semiconductor physics and devices
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Maths, physics and chemistrysolved papers of 37 years jee main and advanced by disha publications
₹ 1000
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*engineering mathematics, mechanics(text book) and physic(edition) for sale *in good condition *very useful for all kinds of course in engineering *problems bits and theories everything covered in these books *market price is + *interested cani contact- price slightly negotiable
₹ 550
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Qr code link to this post offering "physics of semiconductor devices" (hardcover) by simon msze hardcover book with dust jecet868 pages \book in very good -like new condition - see picbuyer pay for shippingshipping from usa
₹ 20000
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Thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernlocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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Thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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Thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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₹ 199
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₹ 330
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₹ 800
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₹ 300
