Hbn
List hbn
-
X bike deluxe 3 hbn india telebrands exercise bought from reliance retail for rsheart beat monitorcan support weight upto 110kgseat adjustableoccupies little space at home and easy to storeselling due to change in exercise regimenmultiple sitting posturesvery convenient to exercise at the comfort of home8 resistance levelslight weight and easy to transportin good condition
₹ 7500
-
Brand new hbn treadmill, peak speed 5hp, normally 2140kg user weight, 16kmp5hp, one year warranty, with bill
₹ 40000
-
Health & fitness product in telebrands company online product for retail sale
₹ 999
-
Resistance training+core strengthening & fat blasting workoutfor lower body workout, multigym fat blaster has a unique feature of pedal cyclereason for sale: relocationfor muscles and cardio try this multi gym fat blaster & see your body go from fat to fitfor more details visit hbnindia websiteproduct is 4 months old
₹ 7000
-
Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernmomentive offers boron nitride insulators and washers for vacuum furnacesdelhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivehot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machined
-
Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbr uses calcium borate as a strengthening binder and is moisture insensitive
-
Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processinglocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitive
-
Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsmarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobhot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitive
