Hbn
List hbn
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X bike deluxe 3 hbn india telebrands exercise bought from reliance retail for rsheart beat monitorvery convenient to exercise at the comfort of homelight weight and easy to transportoccupies little space at home and easy to store8 resistance levelscan support weight upto 110kgselling due to change in exercise regimenmultiple sitting posturesseat adjustablein good condition
₹ 7500
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Brand new hbn treadmill, peak speed 5hp, normally 25hp, one year warranty, with bill140kg user weight, 16kmp
₹ 40000
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Health & fitness product in telebrands company online product for retail sale
₹ 999
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Reason for sale: relocationfor muscles and cardio try this multi gym fat blaster & see your body go from fat to fitfor more details visit hbnindia websitefor lower body workout, multigym fat blaster has a unique feature of pedal cycleproduct is 4 months oldresistance training+core strengthening & fat blasting workout
₹ 7000
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Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsmomentive offers boron nitride insulators and washers for vacuum furnacesits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsdelhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivehot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processing
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Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationslocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobhot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivehigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processing
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Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernlocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivehigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processing
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Grade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivemarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processing
