Epson thermal
List epson thermal
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Round neck cold shoulder thermal top by yoinsloose, slouchy silhouette with a round neck and long sleeves with cutout shoulders + tunic lengththe perfect top for lounging at home or tucking into your favorite denim
India
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thermal printing technology, means you don't need ink ribbon or cartridge for printingmost selling, top rated epson receipt printer which has printing speed up to 150 mm/secyou can grab this printer from our website called justransactbest companion for retail, hospitality, food and beverage environmentsfor an enquiry, don't hesitate to call our toll-free no
₹ 10900
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thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitivemomentive offers boron nitride insulators and washers for vacuum furnacesits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagentsdelhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mob
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thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationslocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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thermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitrideshot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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Hexoloy offers: extreme hardness and high strength virtually universal corrosion resistance good thermal conductivity low thermal expansion excellent thermal shock resistance hexoloy sa sic offers distinct advantages for mining applications hexoloy sa sic is a fully dense, monolithic ceramic with excellent corrosion and erosion resistancethese important qualities coupled with high thermal conductivity make hexoloy sa sic an ideal material for tough mining applicationshexoloy sa sic has provided reliable performance in extreme temperature, pressure and corrosive environmentsmarkets: delhi, mumbai, kolkata, bangalore, chennai, ahmedabad, hyderabad, faridabad, pune, ahmednagar, nagpur, bhopal, coimbatore mob:9910899409a superior alternative to metals, tungsten carbide and alumina ceramics hexoloy sa sic is a superior alternative to metals, tungsten carbide and other alumina ceramics for efficiency, uptime and reliabilityhexoloy sa sic valve trim has set performance standards for use in nickel and gold ore processing
Lalbahadur Nagar (Andhra Pradesh)
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Further, these new hybrid fillers can be a more cost-effective solution for thermal management applications because they can achieve high thermal conductivities at lower bn loadingscoolfx hybrid filler grades can be considered for use to enhance thermal conductivity while providing electrical insulationmomentive's coolfx hybrid fillers are a new generation of materials designed to provide step-change improvements in cost and performance for thermal management applicationscompared with the base resins, compounds made from coolfx hybrid fillers have faster in-mold cooling and hence can be molded on shorter cycles, yielding improved press utilization and consequently higher productivitydesigned to meet the needs of both oems and compounders, these hybrid fillers offer improved physical properties and easier processing with more consistent feeding versus traditional boron nitride fillerspotential end-use applications include led lighting components, consumer electronic devices, aerospace and automotive cooling systems, motor and battery housings, temperature sensors, heat exchangers and more mobmomentive will offer a broad portfolio of the cool fx hybrid fillers to enable use in a wide range of resins in diverse advanced material applications
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Further, these new hybrid fillers can be a more cost-effective solution for thermal management applications because they can achieve high thermal conductivities at lower bn loadingscoolfx hybrid filler grades can be considered for use to enhance thermal conductivity while providing electrical insulationmomentive's coolfx hybrid fillers are a new generation of materials designed to provide step-change improvements in cost and performance for thermal management applicationspotential end-use applications include led lighting components, consumer electronic devices, aerospace and automotive cooling systems, motor and battery housings, temperature sensors, heat exchangers and morecompared with the base resins, compounds made from coolfx hybrid fillers have faster in-mold cooling and hence can be molded on shorter cycles, yielding improved press utilization and consequently higher productivitydesigned to meet the needs of both oems and compounders, these hybrid fillers offer improved physical properties and easier processing with more consistent feeding versus traditional boron nitride fillersboron nitride in delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur mobmomentive will offer a broad portfolio of the cool fx hybrid fillers to enable use in a wide range of resins in diverse advanced material applications
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Gl/ulpyu3 key tags:-hot food delivery bags | pizza delivery bags | thermal pizza bags | thermal bags for food | thermal restaurant food bags delivery bags | back packsour full line of insulated pizza bags will keep your pizza freshgoldendays is the pizza delivery bags manufacturers & suppliers in indiafor more info visit to our website https://goo
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94 inches/second
max resolution(b&w):-300 dpi
media sizes supported :- 228"
connections interface :- usb
printer :- slp650
rscom
mobile: +91-7600033658
https://www5000/-
print technology :- direct thermal
print speed:- 276 inches/second
max resolution(b&w):- 203 dpi
media sizes supported :- 2com
printer :- slp620
rs28"
connections interface :- usb
mech block for slp620 / slp650 (thermal printer head – printhead)
labels
address labels :- slp-4ast, slp-1blb, slp-1rlb, slp-1rlc, slp-2rlc, slp-rtnc, slp-1glb, slp-2rle, slp-2rlh, slp-1olb, slp-1plb, slp-r2rl, slp-trl, slp-1rl, slp-2rl, slp-1ylb
appointment cards:- slp-fcs2
file folder labels:- slp-3hfl, slp-5hfl, slp-flb, slp-4afl, slp-flg, slp-flr, slp-flw
media labels:- slp-35l, slp-27210, slp-drl, slp-vsl, slp-vtl, slp-zip
multipurpose labels:- slp-mrlb, slp-mrlc, slp-mrl, slp-fn, slp-fw, slp-rdo, slp-rmrl, slp-tmrl, slp-mpl4
name badges:- slp-nb , slp-nr
receipt paper:- slp-p150
retail labels:- slp-jwl, slp-rtl
security labels:- slp-tab3, slp-tab4, slp-tp
shipping labels:- slp-srlb, slp-srlc, slp-opsrl, slp-rsrl, slp-srl
etc
company information:-
crystal computer
b-7, laxminagar society,
singanpore road, katargam,
surat -395006, gujarat, india
kishore248@gmail7000/-
print technology :- direct thermal
print speed:- 3Surat (Gujarat)
₹ 5000
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Momentive performance materials coolfx1021 hybrid filler is part of a new generation of materials developed to provide step-change improvements in cost and performance for thermal management applicationspotential applications coolfx 1021 hybrid filler is an excellent candidate to consider for use in a wide range of thermoplastic resins to enhance the thermal conductivity while providing electrical isolationwith coolfx 1021 hybrid filler, thermal conductivities up to or greater than 10 w/mk can be achieved while maintaining electrical isolation, enabling use in a wide range of advanced material applicationspotential end-use applications include: scanning electron microscope image of coolfx 1021 hybrid filler led lighting fixtures consumer electronic devices aerospace, automotive cooling systems motor and battery housings temperature sensors heat exchangers key features and typical benefits electrically insulating improved physical properties more consistent feeding easier extrusion white formulations possible potentially lower total cost mob: 9910899409
Lalbahadur Nagar (Andhra Pradesh)
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"lithafrax" near zero thermal expansion inorganic fillers saint-gobain "lithafrax" powders are crystalline compounds of the formula lialsixoy with near zero thermal expansion coefficientslithafrax is added as a filler for lowering the coefficient of thermal expansion (cte) of the matrixmarkets: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabadpossessing a very low cte over a wide temperature range, lithafrax enables less filler loading for the same degree of cte manipulationlithafrax powders are thermally stable and rohs compliantlithafrax applications include epoxy, sealing glass, encapsulants, coatings, glazes and metal pastesfor over 10 years, lithafrax powders have enabled proven solutions in aerospace, military, electronics, automotive, labware, and building / habitat marketslithafrax fillers provide specific advantages over other fillers
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"lithafrax" near zero thermal expansion inorganic fillers saint-gobain "lithafrax" powders are crystalline compounds of the formula lialsixoy with near zero thermal expansion coefficientslithafrax is added as a filler for lowering the coefficient of thermal expansion (cte) of the matrixmarkets: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad email: mobile numberpossessing a very low cte over a wide temperature range, lithafrax enables less filler loading for the same degree of cte manipulationlithafrax powders are thermally stable and rohs compliantlithafrax applications include epoxy, sealing glass, encapsulants, coatings, glazes and metal pastesfor over 10 years, lithafrax powders have enabled proven solutions in aerospace, military, electronics, automotive, labware, and building / habitat marketslithafrax fillers provide specific advantages over other fillers
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Momentive performance materials coolfx hybrid filler is part of a new generation of materials developed to provide step-change improvements in cost and performance for thermal management applicationspotential applications coolfx hybrid filler is an excellent candidate to consider for use in a wide range of thermoplastic resins to enhance the thermal conductivity while providing electrical isolationwith coolfx hybrid filler, thermal conductivities up to or greater than 10 w/mk can be achieved while maintaining electrical isolation, enabling use in a wide range of advanced material applicationspotential end-use applications include: scanning electron microscope image of coolfx hybrid filler led lighting fixtures consumer electronic devices aerospace, automotive cooling systems motor and battery housings temperature sensors heat exchangers key features and typical benefits electrically insulating improved physical properties more consistent feeding easier extrusion white formulations possible potentially lower total cost mob
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It has the characteristics of high temperature resistance, wear resistance, high temperature creep resistance, low thermal conductivity, low thermal expansion coefficient, chemical corrosion resistance, high strength, high hardness and wave penetration, and is widely used in many fields such as aerospaceceramic matrix composites can maintain high stability in high temperature environments, even in aerobic environments, which reduces the development and application costs of thermal protective coatingsceramic matrix composites can be divided into two categories according to the continuity of the reinforcement: continuously reinforced composites and discontinuously reinforced compositesthrough the optimization of the preparation process, especially the composition and structure design of the interface layer, the mechanical properties of ceramic matrix composites have been qualitatively improved compared with single-phase ceramicscomparison of preparation processes of ceramic matrix composites
chemical vapor infiltration (cvi)
during the preparation process, the fiber damage is small, the prepared ceramic matrix has high purity and complete crystal form, and the mechanical properties of the composite material are high
high temperature resistancecom/news/ceramic-matrix-composite-cmc-material-professional-manufacturer-in-chinain general, it is carried out in conjunction with other methodsunder the condition of no cooling structure, it can be used for a long time at 1200°ccmc material introduction
ceramic matrix composites (cmc) are a type of composite material that is composited with ceramics as a matrix and various fibersoverview of ceramic matrix composites——advantages
lightweight
high stability
continuous fiber-reinforced ceramic matrix composites are the most outstanding type of materials in ceramic matrix
carbon ceramic composite c/sic
carbon ceramic composite c/sic
composites
excellent mechanical propertiesit is a high-performance composite material formed by implanting high-temperature-resistant continuous ceramic fibers into a ceramic matrixthe ceramic matrix composite material has a low density (only 1/3~1/4 of the superalloy), and can be used in components such as combustion chambers, regulating plates/sealing plates, and can directly reduce the mass by about 50%continuous fiber reinforced ceramic matrix composites have been widely used in aerospace, national defense and other fields
ceramic matrix composites refer to the introduction of reinforcing materials into the ceramic matrix to form a composite
carbon ceramic composite
carbon ceramic composite
material with the introduced reinforcing material as the dispersed phase and the ceramic matrix as the continuous phasewith the advancement of fiber preparation technology and other related technologies, people have gradually developed effective methods for preparing such materials, making the preparation technology of fiber-reinforced ceramic matrix composites increasingly matureceramic matrix composites can greatly improve the reliability and consistency of materials while maintaining the excellent performance of a single ceramic material such as high temperature resistance, high strength, and low density
liquid silicon infiltration (lsi)
first, carbon fiber is woven into a three-dimensional fabric (hereinafter referred to as carbon fiber preform); a layer of simple silicon with a thickness of 01-2 μm is deposited on the carbon fiber preform by vapor deposition technology; phenolic resin, carbon black, ethanol, ultrafine silicon carbide powder, polyvinylpyrrolidone and tetramethylammonium hydroxide are prepared in proportion to make a mixed slurry; the slurry is pressurized and impregnated into the above-mentioned carbon fiber prefabricated body in a vacuum environment to obtain a composite material green body; the above-mentioned green body is heated and solidified; the cured green body is placed in a vacuum furnace for high-temperature siliconization reaction to obtain a high-density, high-performance carbon-silicon carbide ceramic composite materialit has high strength and high toughnessthe working temperature of ceramic matrix composites is as high as 1650°c, which can simplify or even eliminate the cooling structure, optimize the engine structure, and increase the working temperature of the engine
the manufacturing cycle is long, the cost is high, and the prepared composite material has high porositytubes, missile radomes, space shuttle nose cones, aircraft brake discs, and high-end automobile brake discs have become an important branch of the field of composite materialsin particular, it has a non-catastrophic fracture mode different from that of a single ceramic, which has attracted great attention from researchers all over the worldIndia
₹ 11
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The machine’s thermal shutdown and overload protection features ensure safe operation) noise level: 58db security measures: thermal shutdown on overheating, thermal overload protection features: – auto start/stop and reverse option – elegant design – pull out basket – transparent bin full indicator uses: the shredder is suitable for various purposes, including: – personal cabin – under desk – small and medium business offices the shredder’s cross-cut capabilities enhance security for paper documents, while the strip-cut function allows for the secure disposal of cds and credit cardswith its user-friendly features, efficient shredding speed, and a combination of cross-cut and strip-cut functions, the cc 15 shredder model is a versatile choice for securely disposing of sensitive documents and media in personal and business settingscontact no ;- 80763 10511
entry width: 220 mm
shred size: 3 x 30 mm (for paper), strip cut for cd, credit card running cycle: 10-15 minutes on, 20-25 minutes off (duty cycle) sheet capacity: 12-15 sheets at a time (a4 size, 70 gsm) cutting speed: 4 mm/min power consumption: 170w power supply: 220v bin capacity: 23 litres (approx[note: product specifications and data are subject to change without notice to improve reliability, function, design, or otherwise] technical specification) dimension: 396 x 313 x 598 mm weight: 14 kg (approxDelhi (Delhi)
₹ 1
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Names - omega dragonis flame saggittarious thermal lacerta lightining l drago ray striker (without perfomence tip) conditions - omega dragonis - opened but not used flame saggittarious - opened but not used thermal lacerta - opened but not used lightining l drago - used nd gud condition rat striker - used nd gud condition (ray striker bey performence tip is missing) brand - hasbro if u want to see closer pic msg me interested person contact me thank you
₹ 2000
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You can either use both the ainwear and a thermal jacket together or separately depending on the weather outsidebrand new gerry 2 pcs winter jacket purchased from the us - contains a rainwear and a thermal jacketonly reason i am not taking it with me abroad is because 2 of my aunts got my son exactly the same jacketyou can also check ebday for more description of this jacket using the search term 'gerry rain wear or gerry winterwear'
₹ 1700