Basic electrical and electronics engineering bpoobook
List basic electrical and electronics engineering bpoobook
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Ace engg complete book material
₹ 8000
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electronics and communication engineering text books (cost varies from 20 to 300 per book) opposite to kerala mess,venkatpura,koramangala 1st block can meet morning before 11am monday to friday night after 9pm monday to friday
₹ 100
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Gate,ies,psu electronics and communication engineering books (cost varies from 20 to 300 per book) opposite to kerala mess,venkatpura,koramangala 1st block can meet morning before 11am monday to friday night after 9pm monday to friday
₹ 100
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Emft book (by prof sadiku) best foreign author book for electronics engineering
₹ 250
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I have some engineering book for bi want to sell this booktech elecrtronic and communication
₹ 2500
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electronics and communication engineering books & gate previous years question papers solvedprice is negotiable
₹ 1700
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Gate electronics & communication engineering
₹ 1999
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electronics branch all theory book,work book,gate previous year book
₹ 1500
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The objective of the department is to provide the students with an environment that explores their minds to quest technically and exploit the resources imbibing knowledge of the highly experienced faculty, thus, serving the nation by providing high quality engineers in the area of electronics and communication engineering
India
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Bangalore (Karnataka)
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New condition 1 month used paper solution till all gate paper with answer and full solution net price 500rupee
₹ 150
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Measurement and metrology book and electrical machines both book want to sell
₹ 250
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₹ 500
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₹ 888
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Inspect electrical componentsidentify electrical problems with a variety of testing deviceselectrical maintenance jobs in chennai install and maintain wiring, controldirect and train workers to install, maintain, or repair electrical wiring or equipment5 years regards, yamuna-hr 73053 and 23220repair or replace wiring, equipment, or fixtures using hand tools and power toolsskills-qualifications-certificate course (iti)(eee, electrical),diploma(eee, electrical)experience-0 to 1
India
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Age: above 30 qualification: mechanical/ electrical -engineering graduates/any degree related to food discipline salary: salary rs00 /year experience: work: 0-1 year (preferred) with kind regards nandhini hr-996232194820,000 job type: full-time on roll salary: 10,000job summary required retired or aged persons for auditing
India
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Good opportunity for plc programmer in chennai plc programmer having experience in electrical and instrumentation field detailed engineering of the plc panelexperience: 1 to 5 years experience education qualification: btech/diploma eee/ece salary: 15k to 18k (esi + pf + food) designation: maintenance required only experienced candidates if you have any quries kindly contact our hr team thanks & regards, preethi-hr 8056918954
Chennai (Tamil Nadu)
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India
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electrical maintenance engineer experience:0 to 1 per month:rs20,000 job type:full time contact:yamuna hr 730- 53-23-220
India
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We are looking for a energetic electrical engineer with bgood salary and benifitsece,eee,mechatronicssub roles: production-engineer,testing-engineer,maintenance-engineer ma x experience: 3 yrs min experience: 2 yrs contact: abitha hr 63-85-23-53-07
India
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Hot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concernlocation: delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur mobgrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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Hot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeslocation delhi, mumbai, kolkata, chennai, bangalore, pune, ahmedabad, vadodra,surat, vapi, aurangabad, kohlapur, raigad, raipur, lucknow, jaipur, udaipur, trivandrum, coimbatore, bhopal, gurgaon, raipur, manesar, bhubaneshwar, jamshedpur, hyderabad, vizag, vijayawada, goa, hosur, nagpur, rajkot, kanpur, india mobhigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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Hot-pressed bn is compacted at temperatures up to c and pressures up to psi to form a dense, strong engineering material that is easily machinedthermal management of electronic devices the unique combination of electrical resistivity and thermal conductivity makes bn an ideal heat sink in high power electronic applicationsfour material grades grades hbc and hbt are our highest purity hot-pressed boron nitridesgrade hbr uses calcium borate as a strengthening binder and is moisture insensitiveits properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finishthey are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applicationsmarkets: chennai, bangalore, hyderabad, trivandrum, kolkata, delhi, ahmedabad, mumbai, pune mobgrade hbn uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concerngrade hbt, although lower in strength and density than hbc, is available at lower cost and shorter lead timeshigh temperature applications temperature stability and excellent resistance to thermal shock make bn the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processingthese characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processesit is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applicationsfor applications demanding even higher strength and durability, momentive offers grade bin77 composite material; see publication for more detailsmolten metal handling bn is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents
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